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BGA and Fine-Pitch Placer
LPKF ProtoPlace BGA placer is designed for the accurate placing of different types of BGA, CSP and flip chip components, as well as fine-pitch and ultra-fine-pitch components.
Semi-automatic placement of complex components to assemble highly integrated circuit boards.
Special optics and adjustable two-colour illumination help to simultaneously view and align the PCB leads and the component pins.
Partner: LPKF Laser & Electronics AG