Desoldering tips for diverse applications
Thin-walled and slim designs for work on densely populated boards.
Standard designs with internal diameters ranging from 0.6 mm up to 2.4 mm.
Thick-walled designs, e. g. to suck residual solder off BGA pads.
Strong vacuum for especially safe desoldering processes.
Very easy to change residual solder container, suitable for continuous operation
Partner: kurtz ersa